Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package
نویسندگان
چکیده
Due to the advantages of good thermal and electrical performance, lower cost, greater design flexibility, fan-out wafer-level package (FOWLP) has been widely used in millimeter-wave applications. In this letter, a with size 12mm×12mm for applications is accomplished by redistribution layer first (RDL-First) process. The double-sided multiple layers (RDLs) are fan out signals form antenna-in-package (AiP). An antenna integration scheme Ultra Short Range automotive Radar (USRR) chips four transmit receive channels was achieved. addition, 1×3 series fed aperture-coupled array area designed. Correspondingly, probe based measurement setup FOWLP-AiP working E band carried out. results agreement simulation.
منابع مشابه
Lead-Free Wafer Level-Chip Scale Package: Assembly and Reliability
This paper discusses the reliability testing results of a lead-free version of the micro SMD, National Semiconductor’s Wafer Level-Chip Scale Package (WLCSP). The micro SMD, a true wafer scale package has proven to be highly adaptable in the conventional assembly process, requiring no special considerations during the surface mount assembly operation. The current micro SMD utilizes standard Sn/...
متن کاملGallium Phosphide IMPATT Sources for Millimeter-Wave Applications
The potentiality of millimter-wave (mm-wave) double-drift region (DDR) impact avalanche transit time (IMPATT) diodes based on a wide bandgap (WBG) semiconductor material, Gallium Phosphide (GaP) has been explored in this paper. A non-sinusoidal voltage excited (NSVE) large-signal simulation method has been used to study the DC and high frequency characteristics of DDR GaP IMPATTs dsigned to ope...
متن کاملA Reliable Wafer-level Chip Scale Package (wlcsp) Technology
In conventional WLCSP process, after defining the under bump metal (UBM) layer, a solder ball is dropped in the UBM opening. A subsequent thermal reflow cycle melts the solder ball and cools it in a well defined shape on top of the UBM layer. One draw back of this technology is the fracture or cracking of passivation film that may occur during the solder ball reflow process. The cracks in the p...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: IEICE Electronics Express
سال: 2022
ISSN: ['1349-2543', '1349-9467']
DOI: https://doi.org/10.1587/elex.19.20220122