Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package

Printed Wideband Antenna for Millimeter Wave Applications

Lead-Free Wafer Level-Chip Scale Package: Assembly and Reliability

This paper discusses the reliability testing results of a lead-free version of the micro SMD, National Semiconductor’s Wafer Level-Chip Scale Package (WLCSP). The micro SMD, a true wafer scale package has proven to be highly adaptable in the conventional assembly process, requiring no special considerations during the surface mount assembly operation. The current micro SMD utilizes standard Sn/...

Gallium Phosphide IMPATT Sources for Millimeter-Wave Applications

The potentiality of millimter-wave (mm-wave) double-drift region (DDR) impact avalanche transit time (IMPATT) diodes based on a wide bandgap (WBG) semiconductor material, Gallium Phosphide (GaP) has been explored in this paper. A non-sinusoidal voltage excited (NSVE) large-signal simulation method has been used to study the DC and high frequency characteristics of DDR GaP IMPATTs dsigned to ope...

A Reliable Wafer-level Chip Scale Package (wlcsp) Technology

In conventional WLCSP process, after defining the under bump metal (UBM) layer, a solder ball is dropped in the UBM opening. A subsequent thermal reflow cycle melts the solder ball and cools it in a well defined shape on top of the UBM layer. One draw back of this technology is the fracture or cracking of passivation film that may occur during the solder ball reflow process. The cracks in the p...

Radiation pattern measurement method for on-wafer mm-wave antenna

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