Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package

نویسندگان

چکیده

Due to the advantages of good thermal and electrical performance, lower cost, greater design flexibility, fan-out wafer-level package (FOWLP) has been widely used in millimeter-wave applications. In this letter, a with size 12mm×12mm for applications is accomplished by redistribution layer first (RDL-First) process. The double-sided multiple layers (RDLs) are fan out signals form antenna-in-package (AiP). An antenna integration scheme Ultra Short Range automotive Radar (USRR) chips four transmit receive channels was achieved. addition, 1×3 series fed aperture-coupled array area designed. Correspondingly, probe based measurement setup FOWLP-AiP working E band carried out. results agreement simulation.

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ژورنال

عنوان ژورنال: IEICE Electronics Express

سال: 2022

ISSN: ['1349-2543', '1349-9467']

DOI: https://doi.org/10.1587/elex.19.20220122